SiC Processing AG

SiC Processing is the market leading service provider in the field of wet separation, treatment and reclamation of used wafer cutting slurry.

The company specializes in the recycling and supply of cutting fluids that are used to produce wafers for the solar and semiconductor industries. The company’s unique recycling technology offers substantial cost savings over new material, as well as the ability to recycle the fluids an indefinite number of times.

SiC is headquartered in Germany, has production sites in Germany, Norway, Italy, USA and China and has a joint venture in China and the USA with Meyer Burger.