SiC Processing AG, one of the leading providers for the processing of used slurry from the wafer industry, has acquired a three percent stake in Iosil Energy Corporation.
Iosil, based in Albuquerque, USA, has developed a method to extract high-purity polysilicon from the waste material (Kerf) caused by wafer sawing. Due to the fact that 45 percent of the polysilicon produced is lost in wafer sawing, this represents a significant cost saving potential for the solar industry.
“This investment is another step to expand our business relationships and to benefit from knowledge transfer in both directions”, says Thomas Heckmann, CEO of SiC Processing AG. Iosil was the first company to extract high-purity polysilicon from Kerf and hence to make it reusable. Both Iosil and SiC Processing aim to help their clients to significantly reduce their costs and gain a competitive advantage in a highly competitive industry.
About SiC Processing AG
SiC Processing AG is one of the leading providers for the processing of used slurry from the wafer industry. The company has a broad and international customer base consisting of wafer manufacturers. The philosophy of the SiC Group includes long term contracts, a close and established mutual trust and a partnership-based business model.
About Iosil Energy Corporation
Iosil Energy Corporation, founded in 2007, has its R+D facilities located in the National Institute for Nanotechnology in Edmonton, Alberta, with headquarters located in Albuquerque, New Mexico. Iosil has a strong patent portfolio including a worldwide exclusive license for two patents developed at the National Renewable Energy Laboratory (NREL) in Golden, Colorado. For more information about the company please visit the website at www.iosil-energy.com.